Rework Solutions


BGA Re-Balling Kit

IIT's re-balling kit consists of a FR4 base with a custom machined pocket for holding the component, a stencil for printing, and a stencil to align and hold the solder balls in place during reflow. Four registration pins ensure perfect alignment between component and stencils. This kit is also used for re-working QFN and other leadless devices.


Single Component Rework Stencils

Stencils are custom made to fit any component package. Custom relief areas are also used to eliminate the need to remove neighboring components.

IIT manufactures stencils for many types of rework machines. Drawings or sample stencils may be requested to ensure proper fit of the stencil within the rework machine.